2026³â 01¿ù 29ÀÏ ¸ñ¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Quectel Unveils Ultra-Compact 5mm x 5mm x 1.05mm LS550G GNSS Module for Positioning in Low-Power Applications

´º½ºÀÏÀÚ: 2025-01-20


Photo : quectel.com

LAS VEGAS -- Quectel Wireless Solutions, a global IoT solutions provider, introduced the LS550G, an ultra-compact multi-constellation GNSS module engineered for fast and accurate positioning. With its 5mm x 5mm x 1.05mm form factor, the LS550G is the ideal solution for power- and space-sensitive applications, especially those that require very thin modules including portable and wearable devices.

The LS550G GNSS module supports concurrent reception of GPS, GLONASS, Galileo, BDS, QZSS and SBAS constellations, enhancing satellite visibility, reducing time to first fix, and improving positioning accuracy, particularly in dense urban environments. Equipped with dual integrated LNA, TCXO and RTC, the module offers high sensitivity, enabling accurate positioning, fast acquisition, and reliable performance even in challenging conditions.

The System-in-Package (SIP) technology minimizes the module’s size, delivering an ultra-compact form factor of just 5.0 mm × 5.0 mm × 1.05 mm. This design not only saves space but also reduces signal attenuation, minimizes interference, moisture ingress and corrosion and enhances shock resistance.

“The LS550G exemplifies our commitment to innovation in GNSS technology, offering exceptional performance in an ultra-compact form factor,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “With its multi-constellation support and advanced SIP design, the LS550G is the ideal solution for applications requiring high accuracy, low power and compact form factor even in the most challenging environments.”

The LS550G features a -165dBm tracking and -147dBM acquisition sensitivity without an external LNA. It supports anti-jamming functionality with an embedded multi-tone active interference canceller, ensuring the module can mitigate or resist interference from unwanted signals that could disrupt its ability to accurately determine location.

The LS550G module, delivering high performance with ultra-low power consumption—just 28mW at 1.8V while utilizing four GNSS constellations. The Enhanced Prediction Orbit on Chip (EPOC) technology allows the module to automatically calculate and predict satellite orbits using ephemeris data stored in internal RAM, valid for up to 3 days. This enables the LS550G to achieve fast position fixes, even under low signal conditions, while maintaining energy efficiency.

The enhanced performance of the LS550G makes it an excellent choice for a wide range of consumer and industrial applications. Its ultra-compact form factor and low power consumption make it the ideal solution for space- and power-sensitive applications such as wearable devices, sport and asset trackers as well as elderly care products.



 Àüü´º½º¸ñ·ÏÀ¸·Î

Hisense Joins HEVC Advance Patent Pool
Media Partners Asia Launches the AETHER Summit Uniting AI, Creativity, and Infrastructure
HD Hyundai and Palantir Expand Group-Wide Strategic Partnership
Rigaku Launches XTRAIA MF-3400, a Measuring Instrument for Next-generation Semiconductors
Quectel Launches SP895BD-AP Smart Module, Powering the Next Generation of Intelligent IoT Applications
Mainland China¡¯s Smartphone Market Declined 1% in 2025 as Huawei Reclaimed the Top Spot After Five Years
Nanhua Singapore Becomes Exchange and Clearing Member of ICE Futures Singapore and ICE Clear Singapore

 

Takeda, Protagonist Submit NDA for Rusfertide to Treat Polycythemia Ve...
AI Drives Semiconductor Revenues Past $1 Trillion for the First Time i...
Murata Unveils World¡¯s First 15nF/1.25kV C0G MLCC in 1210-inch Size
iQmetrix Announces First-Ever ¡°Telecom Retail Summit¡± at MWC Barcelo...
Axelspace Signing Agreement on a Multi-Launch Arrangement and the Laun...
Quectel Launches First 5G-Advanced R18 Automotive Cellular Module With...
Toshiba Unveils Lens-Reduction CCD Linear Sensor for Faster Data Reado...

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚ Ç¥±â¿¡ ´ë¸¸½Ä À½Â÷ Ç¥±â '纽ÞÙó¢ ´Ï¿ì½ÃÁö' º´±â
º£³×ÇÁ·Ò º£³×ÀÎÅõ Áß¹® Ç¥±â 宝Ò¬ÜØÙÌ 宝Ò¬ì×öõ(ÜÄÒ¬ÜØÙÌ ÜÄ...
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®¿ìºê Alliuv ä¹备, ¾Ë¶ã Althle ä¹÷åìÌ
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¹ÙÀÌ¿ÀÀÌ´Ï Bioini Áß¹® Ç¥±â ù±药研 ù±å·æÚ
¿À½ºÇÁ·Ò Ausfrom 奥ÞÙÜØÙÌ, À£ÇÁ·Ò Welfrom 卫ÜØÙÌ
¿¡³ÊÇÁ·Ò Enerfrom 额ÒöÜØÙÌ ¿¡³ÊÀ¯ºñ Eneruv 额Òöêó备
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØÙÌ ä¹ì³ÜØÙÌ

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..